The HYPERSONIC Project
HYPERSONIC: High mobilitY Printed nEtwoRks of 2D Semiconductors for advanced electrONICs. Funded by Horizon Europe Guarantee.
The rapidly evolving field of wearable electronics and the Internet of things is driving the need for cheaper, more flexible and higher-performance printed electronic circuitries. Despite advances in the field, current printed electronic devices still significantly lag behind traditional silicon-based electronics in mobility. The EIC-funded HYPERSONIC project will address this gap. Researchers will leverage 2D semiconducting nanosheets to achieve mobilities of 100s of cm2/Vs, approaching silicon. Their strategy involves chemical crosslinking of nanosheets and synthesising high-aspect-ratio nanosheets to minimise junction resistance. If successful, this groundbreaking approach could outperform existing standards and produce ultra-cheap, high-performance electronic devices, leading to next-generation wearable sensor arrays with integrated, printed digital and analogue circuits..
Investigators
Postdoctoral Research Associates
Partners
Academic Partners
Trinity College Dublin
Université de Mons
University of Strasbourg
University of Antwerp
Industrial Partners
mSEMICON
News
22/09/2025 – We were delighted to host a successful meeting in Cambridge, which included an intellectual property training session, discussions on ongoing projects, and exploration of future directions.
Publications
Publications